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1. 2. 3. 4. Robert L. Swiggett, Introduction to Printed Circuits, John F. Rider Publisher, Inc., New York, 1956. Private communication with John McCormack, PCK Technology, Division of Kollmorgen Corporation. C. R. Shipley, Jr., U.S. Patent 3,011,920, Dec. 5, 1961. R. J. Zebliski, U.S. Patent 3,672,938, June 27, 1972.

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The field of base materials can appear deceptively simple. In simple terms, base materials are comprised of just three components: the resin system, the reinforcement, and the conductive foil. However, the variants in each of these components and the many possible combinations of these components make the discussion of base materials much more complex. One of the primary reasons for this complexity is the fact that printed circuits are used in so many differing applications. This results in many different sets of requirements in terms of cost and performance, and therefore many grades of base materials. Also, because base materials are the most fundamental components of the printed circuit itself, they interact with virtually every other printed circuit manufacturing process.Therefore, not only are the physical and electrical properties of the material critical, but their compatibility with manufacturing processes is also of great importance. In addition, the advent of the European Union s Restriction of Hazardous Substances (RoHS) directive and the lead-free assembly processes that result are redefining the requirements for base materials. RoHS has a severe impact on all aspects of base materials technology. The impact of lead-free assembly on base materials and a method of selecting materials for lead-free assembly are discussed in Chaps. 10 and 11. Requirements to support circuit densification, reliability, and electrical performance are also critical and will be discussed in Chap. 9. This chapter discusses grades and specifications of base materials, as well as the manufacturing processes used to make them.

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ISR: mov R0, SREG ;Interrupt subroutine code ; .... ; .... mov SREG, R0 reti ;start of interrupt subroutine ;copy SREG value into R0

The various types of base materials can be classified by the reinforcement type, the resin system used, the glass transition temperature (Tg) of the resin system, as well as many other properties of the material. With the advent of lead-free assembly processes, properties other than Tg are becoming as important, if not more important when selecting a base material. The decomposition temperature (Td) is one of these properties and will be defined shortly.

The most commonly referenced specification for base materials is IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. Historically, the National Electrical Manufacturers Association, NEMA, has also been used in specifying base materials.

107 lbf (47715 N) (at e = 05) 428 000 lbf/in (74,900 N/mm) (0 < e < 05) 035 scfm (991 l/min)

NEMA Industrial Laminating Thermosetting Products One of the first classifications of base materials for printed circuits (and other electrical components) was completed by the National Electrical Manufacturers Association (NEMA). NEMA s industrial laminating thermosetting products standard documents many of the materials used in printed circuits as well as specifications for some of their properties. Historical NEMA grades are outlined in Table 6.1 and cross-referenced with IPC-4101 in Table 6.2. Some of the commonly used materials have been FR-2, CEM-1, CEM-3, and, of course, FR-4.

TABLE 6.1 NEMA Base Material Grades Grade XXXPC FR-2 FR-3 FR-4 FR-5 FR-6 G-10 CEM-1 CEM-2 CEM-3 CEM-4 CRM-5 CRM-6 CRM-7 CRM-8 Resin Phenolic Phenolic Epoxy Epoxy Epoxy Polyester Epoxy Epoxy Epoxy Epoxy Epoxy Polyester Polyester Polyester Polyester Reinforcement Cotton Paper Cotton Paper Cotton Paper Woven Glass Woven Glass Mat Glass Woven Glass Cotton Paper/Woven Glass Cotton Paper/Woven Glass Woven Glass/Mat Glass Woven Glass/Mat Glass Woven Glass/Mat Glass Woven Glass/Mat Glass Mat Glass/Glass Veil Mat Glass/Glass Veil Flame Retardant No Yes Yes Yes Yes Yes No Yes No Yes No Yes No Yes No

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